Kurniawan, Rakhmat A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue. UIN Sumatera Utara Medan.
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Jenis Item: | Lainnya |
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Subjects: | 600 Technology (Applied sciences) > 604 Special topics |
Pengguna yang mendeposit: | Mr Biro Kepegawaian |
Date Deposited: | 20 Jun 2023 06:02 |
Last Modified: | 20 Jun 2023 06:03 |
URI: | http://repository.uinsu.ac.id/id/eprint/19628 |
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