A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue

Kurniawan, Rakhmat A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue. UIN Sumatera Utara Medan.

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Jenis Item:	Lainnya
Subjects:	600 Technology (Applied sciences) > 604 Special topics
Pengguna yang mendeposit:	Users 4895 not found.
Date Deposited:	20 Jun 2023 06:02
Last Modified:	20 Jun 2023 06:03
URI:	http://repository.uinsu.ac.id/id/eprint/19628

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