Hasil Cek Similiarity A Micromechanical Data‑Driven Machine‑Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue

Kurniawan, R. Rakhmat and Sayed, Biju Theruvil and Sari, Arif and Luna, Jorge Paucar and Kareem, A. K. and Hussien, Naseer Ali (2023) Hasil Cek Similiarity A Micromechanical Data‑Driven Machine‑Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue. Universitas Islam Negeri Sumatera Utara Medan. (Submitted)

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Jenis Item:	Lainnya
Subjects:	000 Generalities > 001 Knowledge
Divisions:	Artikel (Jurnal, Koran, Majalah)
Pengguna yang mendeposit:	Ms Nurul Hidayah Siregar
Date Deposited:	20 Jun 2023 07:01
Last Modified:	20 Jun 2023 07:01
URI:	http://repository.uinsu.ac.id/id/eprint/19630

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